CUPERTINO, CALIFORNIA – Apple’s latest iPhones, the 15 Pro and 15 Pro Max, already boast incredibly thin bezels, but rumors suggest that the tech giant is aiming for an even more impressive design with the upcoming iPhone 16 Pro and iPhone 16 Pro Max. Reports indicate that Apple plans to reduce the bezels by up to 40 percent, providing both flagship models with a remarkable ‘screen to body’ ratio. This design innovation is expected to result in larger displays without significantly increasing the overall size of the devices, enhancing portability and user comfort.
The iPhone 16 Pro and iPhone 16 Pro Max are rumored to feature 6.3-inch and 6.9-inch displays, respectively, representing a notable increase in screen size for the company. According to sources, Apple is exploring the use of ‘Border Reduction Structure’ technology to achieve bezels as thin as 1.15mm for the iPhone 16 Pro Max and 1.20mm for the iPhone 16 Pro. While the exact method behind this technological advancement remains undisclosed, previous reports suggested that Apple might utilize ‘low-injection pressure over-molding’ (LIPO) technology for this purpose.
If Apple successfully implements the ‘Border Reduction Structure’ technology in the iPhone 16 Pro and iPhone 16 Pro Max, it could potentially lead to a higher production cost for the devices. However, previous speculations about price hikes for earlier iPhone models did not materialize, leaving room for uncertainty regarding potential cost changes. Notably, reports indicated that the bezels on the iPhone 15 Pro measured 1.71mm, but Apple aimed to reduce this measurement to 1.55mm, underscoring the company’s dedication to pushing the boundaries of smartphone design.
As with any rumor, it is advisable to approach these reports with caution until official confirmation from Apple. Whether the speculated bezel reduction will impact the pricing strategy for the iPhone 16 Pro and iPhone 16 Pro Max remains to be seen. Apple enthusiasts eagerly anticipate further updates on these upcoming flagship devices.