San Francisco, California – Google’s upcoming Pixel 10 smartphone is making headlines as new information emerges about the development of its custom chip, the Tensor G5. This comes after reports last year indicated that Google was shifting towards a new chip named “Redondo” for a 2025 release, following delays with an earlier version.
The Tensor G5 is expected to utilize TSMC’s advanced 3-nanometer manufacturing process, incorporating Integrated Fan-Out technology to enhance power efficiency and reduce thickness. These technical advancements mark a significant step forward in Google’s hardware development efforts.
Recent revelations from a trade database confirm the utilization of TSMC’s technology in the upcoming chip, further solidifying Google’s commitment to pushing the boundaries of innovation in the smartphone market. The chip’s design, featuring 16GB of RAM from Samsung, is tailored to support cutting-edge AI capabilities like Gemini Nano and its upcoming multimodal functions.
Furthermore, details about the chip’s production process shed light on Google’s global collaborations, with the company’s operations in Taiwan and India playing crucial roles in the development and testing of the Tensor G5. This international collaboration underscores Google’s strategic approach to hardware engineering and innovation.
The use of InFO_PoP technology in the chip’s packaging highlights TSMC’s industry-leading advancements in 3D wafer-level packaging, showcasing superior performance and efficiency compared to traditional packaging methods. The focus on technological advancements underscores Google’s commitment to delivering high-performance hardware to its users.
Despite delays with the Tensor G4, which remains manufactured by Samsung, Google’s efforts towards the Tensor G5 demonstrate the company’s dedication to pushing the boundaries of smartphone technology. The anticipation for the Pixel 10, with its advanced chip and potential design upgrades, sets the stage for an exciting future in Google’s smartphone lineup.